Applied Materials opens new $5B chip research facility to accelerate collaborative semiconductor innovation

Posted

Semiconductor industry giant Applied Materials Inc. today opened the doors to its Equipment and Process Innovation and Commercialization Center, a massive new $5 billion facility in Silicon Valley that’s set to enable the next wave of breakthroughs in the commercial chipmaking industry. The new EPIC Center, as it’s called, was built by Applied in order […]

The post Applied Materials opens new $5B chip research facility to accelerate collaborative semiconductor innovation appeared first on SiliconANGLE.



Continue reading at SiliconANGLE »

Infra, NEWS, The-Latest, advanced chip packaging, AI compute, AI infrastructure, Applied Materials, chip innovation, chip packaging, chip research, EPIC Center, Gary Dickerson, industry collaboration, Lip-Bu Tan, R&D center, Research and development, semiconductor research